High Temperature SOFC Sealing Paste (CAP-552) |
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 This sealing paste is recommended for gas-tight,hard-bonding SOFC cells to metals and ceramics and can be used in both button cell testing and stack development. It has the best rating for bonding to Ni-Fe metal alloys.
Specs:
Will air-set in 1-4 hours ; recommended to be cured at 200°C for 2 hours followed by 500°C for 2 hours before use. |
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